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99.95% Pure Tungsten Targets with W1 ASTM B760

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Product Detail

    99.95% Pure Tungsten Targets With W1 ASTM B760

    Tungsten titanium alloy sputtering target can be used to make the diffusion barrier for semiconductor chips, the new solar cell and the ceramic thin film circuit.

    Tungsten silicon alloy sputtering target can be used for the ohmic contact layer of the semiconductor chips.

    Type

    W(wt%)

    Ti(wt%)

    Si(wt%)

    Purity(wt%)

    Density(%)

    Grain Size& (µm)

    Dimension (max.mm)

    Ra

    WTi10

    90±0.5

    10±0.5

    /

    99.9-99.999

    =99

    ?10

    ?400×40

    =1.6

    WTi20

    80±0.5

    20±0.5

    /

    99.9-99.995

    =99

    ?10

    ?400×40

    =1.6

    WSi10

    90±0.5

    /

    10±0.5

    99.9-99.999

    =99

    ?10

    ?400×40

    =1.6

    WSi20

    80±0.5

    /

    20±0.5

    99.9-99.999

    =99

    ?10

    ?400×40

    =1.6


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Shaanxi Aone Titanium Metal Materials Co.,Ltd

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